On August 6, the Universal Chiplet Interconnect Express (UCIe) Consortium officially released UCIe 3.0, marking a major step forward in chiplet integration, particularly in data transmission speeds and energy efficiency. The new specification doubles the data transfer rate to 64 GT/s—up from 32 GT/s in UCIe 2.0—paving the way for more advanced and power-efficient System-in-Package (SiP) designs, especially for AI, high-performance computing (HPC), and next-generation communications.

UCIe 3.0 brings a host of technical upgrades designed to unlock greater flexibility and performance for multi-chip systems. Notably, runtime recalibration allows dynamic tuning of interconnect parameters, helping reduce power consumption during operation. Extended sideband transmission increases the sideband channel length up to 100mm, enabling more versatile chiplet topologies and enhanced heterogeneous integration.

The specification also introduces continuous transmission in raw mode, tailored for latency-sensitive applications like AI inference and 5G infrastructure. System-level management gets a boost, with support for prioritized sideband packets, standardized firmware preloading, and faster throttling and shutdown responses during critical scenarios.

UCIe 3.0 maintains full backward compatibility with earlier versions, from 1.0 through 2.0, and adopts a modular approach to system management. This modularity allows designers to selectively implement features based on project needs—reducing unnecessary complexity and optimizing resource allocation.

Cheolmin Park, Chair of the UCIe Consortium and Executive Vice President at Samsung Electronics, emphasized that UCIe 3.0 lays the groundwork for high-bandwidth, energy-optimized, and flexible SiP solutions. The enhanced specification is set to reshape multiple sectors. For AI and HPC, faster interconnects mean more efficient processing. In 5G and telecom, new signaling and transmission features enhance chip-level communication. For automotive electronics, modular design enables quicker integration of components from different chip makers, speeding up development and reducing costs.

Leading IP design tool providers such as Synopsys have already announced UCIe 3.0-compatible solutions. First chip designs based on this new standard are expected to begin in 2026, with mass production anticipated between 2028 and 2029, according to TechPowerUp.

More than just an incremental update, UCIe 3.0 represents a pivotal evolution in chiplet ecosystems. As applications in AI, computing, and connectivity continue to expand, this latest standard could become a foundational force driving innovation and integration in the years ahead.