According to industry sources, TSMC's 2nm (N2) process is on schedule for volume production in Q4 2025, with wafer pricing estimated around $30,000 each. Major tech players—including Apple, AMD, Qualcomm, MediaTek, Broadcom, and Intel—are expected to ramp up production or start collaborations by the end of the year, aiming to secure capacity early.

TSMC's production capacity for N2 is projected at 45,000–50,000 wafers per month across its Baoshan and Kaohsiung sites by the end of 2025, expanding to 100,000 wafers monthly in 2026. With the Arizona Fab21 P2 starting early production, total capacity could reach approximately 200,000 wafers by 2028. A U.S.-based P3 facility, focused primarily on 2nm, is also in the planning stage.

Initial N2 capacity will be heavily allocated to Apple, which will take nearly 50%, followed by Qualcomm. Starting in 2027, production volumes will grow as more clients join.

On the process front, TSMC's N2P and A16 chips are expected to enter production in the second half of 2026, with A14 slated for 2028. F20's P1 and P2 lines will focus on 2nm, while P3 and P4 will transition to A14 by late 2027. F22 is planned with six fabs: P1–P5 for 2nm and P6 for A14. The main A14 production hub will be Taichung F25, targeting volume output in the second half of 2028.

Looking ahead to 2026, the six major customers' wafer volumes will rise significantly. By 2027, over ten additional tech leaders—including Amazon's Annapurna, Google, Marvell, and Bitmain—are expected to join, driving further demand for 2nm chips. To meet these plans, TSMC is simultaneously increasing monthly capacity at Fab20 in Hsinchu Baoshan and Fab22 in Kaohsiung. Continued full utilization of 4/3nm lines through 2026 is expected to help offset tariff, currency, and cost pressures, supporting strong profitability in 2025 and 2026.