On August 28, SK hynix announced the launch of the industry's first mobile DRAM using a new "High-K EMC*" material designed to deliver far better heat dissipation.

**Epoxy Molding Compound (EMC): a critical material for semiconductor packaging that protects chips from various external conditions such as water, heat, impact and electronic charge and provides a channel where heat can be dissipated. High-K EMC raises thermal conductivity with adoption of a material with high heat-transfer coefficient in EMC

With the rise of on-device AI, smartphones are processing massive amounts of data at high speed, which often leads to overheating and performance drops. SK hynix's new DRAM directly tackles this challenge, winning strong recognition from global customers.

Today's flagship smartphones typically adopt a Package-on-Package (PoP*) design, stacking DRAM directly on top of the application processor*. While this improves speed and space efficiency, it also traps heat inside the DRAM, which can drag down overall device performance.

**Package on Package (PoP): a packaging method commonly used for mobile products. Different types of chips are stacked vertically to improve space efficiency, performance and flexibility of combinations

**Mobile Application Processor (AP): chip referred to the brain of mobile devices such as smartphones and tablets

To solve this, SK hynix enhanced the thermal conductivity of the key packaging material, EMC. By mixing alumina with conventional silica, the company developed the High-K EMC material, boosting thermal conductivity by 3.5 times and cutting vertical thermal resistance by 47%.

This breakthrough improves system-level performance, reduces power consumption, extends battery life, and enhances product durability. SK hynix expects the new DRAM to draw strong interest and demand across the mobile industry.

Lee Gyujei, Head of Package Product Development at SK hynix, commented: "This product not only boosts performance but also addresses one of the biggest pain points for high-end smartphone users. It's a meaningful step toward reinforcing our leadership in next-generation mobile DRAM."