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Discover what push switches are, how they work, their key features, types, and common uses across consumer electronics, automotive, industrial, and medical fields.

Intel’s advanced 18A chip process faces yield challenges, pushing Panther Lake’s mass production from late 2025 to early 2026, impacting Intel’s production plans.

Learn how to repair your security camera by replacing faulty capacitors, improving fan connections, and upgrading to a solar-powered system for reliable use.

Samsung secures iPhone image sensor orders from Apple, marking a decade-long return and challenging Sony's dominance with advanced three-layer wafer tech.

UCIe 3.0 boosts chiplet data speeds and power efficiency, driving AI, HPC, and 5G advances with new features like runtime recalibration and modular design.

Discover the Infineon XC164CS32F40FBBAKXQMA1 16-bit MCU with 256KB Flash, CAN controller, and automotive-grade specs. Learn its features, specs, datasheet, and key applications.

Explore the key differences between standard and high-speed optocouplers in speed, performance, and use cases. Find out which is best for your electronic design.

TSMC reports NT$323.17B revenue for July, up 25.8% YoY, fueled by strong AI demand. Q3 forecast remains positive as U.S. fab and capex plans progress.

Learn how to upgrade your digital alarm clock with a phone battery, RX8025 module, UV LED backlight, and glow film for better accuracy and energy saving.

Tesla is reportedly teaming up with Samsung for Dojo 3 chip production and Intel for advanced packaging, signaling a major shake-up in its AI hardware supply chain.